Samsung Global Research Outreach (GRO) Programme 2020 Call for Proposals

 

The Samsung Global Research Outreach (GRO) Programme is part of the Samsung Advanced Institute of Technology (SAIT) academic research engagement and collaboration platform. Since 2009, Samsung has conducted more than 150 collaborative research projects to develop innovative technologies with academic researchers from around the world.

The GRO programme issues an annual call to invite proposals for innovative research ideas which will be evaluated for their novelty and alignment with Samsung's various fields of interest. Selected projects may receive funding in the order of $150,000 per year (initially for one year, with possible annual extensions for up to three years) to develop the proposed technology in partnership with Samsung.

The 2020 GRO Programme is seeking proposals in 11 research themes, with associated specified challenges:

  • Ultralow-power Cryogenic Computing:
    • Ultralow-power Device for Cryogenic Computing
    • Ultralow-power Architecture for Cryogenic Computing
  • Metaphotonics for Next Information & Communication Technologies:
    • Metaphotonics for next computing and information processing
  • Next generation DRAM/NAND:
    • Concept, Device & 3D implementation technology
  • Functional Oxides:
    • Oxide Thin Films for Memory and Logic Applications
  • New Quantum Dot:
    • Quantum dot of new structure and composition
    • Safety analysis of quantum dot
  • New Light Sensitive Materials:
    • Acid Generation Materials
    • Dendrimer Materials
  • Privacy Preserving Computing:
    • Machine Learning Models & Applications using Privacy Preserving Computing
  • Machine Intelligence:
    • On-device Artificial Intelligence
  • 6G Communication Systems:
    • Physical layer and hardware component innovation for upper mmWave and THz technology
  • Fundamental Technology for Semiconductor Equipment:
    • Plasma RF Generation to overcome extreme semiconductor process challenge
    • Next-generation Computational Imaging technique for semiconductor wafer metrology and inspection
    • EUV Source Improvement and Simulation Technology
    • Precision Heater and Temperature Measurement Technology
  • Bulk Acoustic Wave:
    • Loss Mechanisms and Causes of Failure under High Power Loads in BAW Resonators
    • Multiplexer Design (including topology), simulation for 5G communication (Wide Bandwidth, lower attenuation, high power)
    • Filter level thermal mechanism analysis (Heat Transfer)

Other themes are also welcomed.

Responses to the 2020 Call for Proposals should be submitted by the deadline of 25 August 2020.

Proposals will be assessed in September 2020 and successful projects announced in October 2020.

 

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